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高分子材料

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高分子材料(FG-PG)
高分子材料(FG-PG)
产品概述:
高分子材料(FG-PG) Polymer masking protective materials——玻璃/蓝宝防护系列 Glass/sapphire-based protective material series基本概况 General Introduction应用于…
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详细介绍

高分子材料(FG-PG) Polymer masking protective materials

——玻璃/蓝宝防护系列 Glass/sapphire-based protective material series


基本概况 General Introduction

应用于光学玻璃在开料、CNC精雕过程中的临时性遮蔽防护。主要应用于玻璃盖板、蓝宝石玻璃、工艺玻璃等的分切遮蔽防护领域。 

Temporary masking protection in processing of optical glass Cutting and CNC carving,mainly used in the protection field of glass cover,sapphire glass and craft glass Cutting.


玻璃/蓝宝石基材系列 Glass/Sapphire based Series
室温固化型高分子遮蔽防护材料(FG-PGR) Room temperature curing protection composite
感光型高分子遮蔽防护材料(FG-PGP) Photosensitive protection composite

感光型抗酸高分子遮蔽防护材料(FG-PGA) Photosensitive acid-resistant protection composite


三大特点 Characteristics

耐氢氟酸 Hydrofluoric acid resistance    抗CNC Anti-CNC    纯水脱膜 Purified water decoating


应用方法 Application method

工序

NO

工艺

Procedures

感光型(FG-PGP)

Photosensitive Type

室温固化型(FG-PGR)

RT Curing Type

感光型抗酸(FG-PGA)

Photosensitive Type Anti-acid

1

覆膜方式

Laminating Model

丝印

Silk print

喷涂

Spraying

丝印

Silk print

2

固化

Curing

UV能量1200-1600MJ/cm2

UV energy 1200-1600MJ/cm2

室温,1min

RT,1min

UV能量1200-1600MJ/cm2

UV energy 1200-1600MJ/cm2

3

脱膜

Decoating

纯水,85℃,10min

Purified water,85℃,10min

5%NaOH,45℃,2min

5%NaOH,45℃,2min

脱膜剂,45℃,3min

Decoating agent,45℃,3min


技术参数 Technology Parameter

测试项目

Items

感光型

Photosensitive Type

室温固化型

RT Curing Type

感光型抗酸

Photosensitive Type Anti-acid

附着力

Adhesive force

百格试验≥4B

Cross-cut test≥4B

百格试验≥4B

Cross-cut test≥4B

百格试验≥4B

Cross-cut test≥4B

表面硬度

Surface hardness

铅笔硬度计≥3H

Pencil Hardness tester≥3H

铅笔硬度计≥2H

Pencil Hardness tester≥2H

铅笔硬度计≥H

Pencil Hardness tester≥H

耐腐蚀性

Anti-corrosion property

切削液(常温,6H)无起泡,无脱落

Cutting fluid(RT,6H)No bubbling andpeeling

切削液(常温,6H)无起泡,无脱落

Cutting fluid(RT,6H)No bubbling andpeeling

20%氢氟酸,30min,无起泡,无脱落 2

0%Hydrofluoric acid,30min,No bubbling and peeling

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